|
DELO-MONOPOX
1-komponents epoxi DELO-MONOPOX är ett en-komponents värmehärdande epoxilim för limning, ingjutning och tätning av fogar. Epoxi lim är ett höghållfast material som kan användas som alternativ till nitning, svetsning och lödning i applikationer som utsätts för hög stress.
Epoxi har utmärkt vidhäftning på metaller, ferriter och keramik. Särskilda fördelar med epoxi jämfört med andra lim är deras motståndskraft mot temperatur, kemikalier och låg vattenabsorption. De skyddar också mot korrosion.
Epoxilimmet levereras färdig att använda utan att blandning krävs. Härdning av sker i 15-75 minuter @ 130-180 grader C, respektive 80- 170°C för de nya mCD limmerna . Produkter finns med allt från låg viskositet, med goda utflytningsegenskaper till mycket högviska som inte vare sig rinner eller flyter ut.
 Monopox (Selection chart) |
|
|
Product
|
Viscosity
[mPas] |
Elongation
at tear [%] |
Caracteristics |
|
Good bonding materials/applications |
|
| 1196 |
290.000 |
1.4 |
Epoxy, aluminium filled, high strength bonding, good flow |
|
Metal, temperature-resistant plastic, ferrite and ceramic |
|
| 1197 |
Pasty |
1.4 |
Epoxy, aluminium filled, high strength, high run resistance |
|
Metal, temperature-resistant plastic, ferrite and ceramic |
|
| 6093 |
40.000 |
1.6 |
Epoxy, unfilled, low water absorption, excellent thermal stability |
|
For casting, coating and fixing of components |
|
| 6095 |
50.000 |
1.2 |
Epoxy, unfilled, v-low ions content, ideal for electronics |
|
For casting, coating and fixing of components |
|
| AC265 |
26.000 |
1.7 |
Epoxy, unfilled, Anisotropic Conductive, NIAu particles |
|
Flip-chip, Smart card and Smart label aplications |
|
| * AC365 |
40.000 |
2.4 |
mCD, Anisotropic Conductive, low temperature curing 80°C |
|
Flip-chip, Smart card and Smart label aplications |
|
| AD066 |
20.000 |
2.5 |
Epoxy, beige, unfilled, fast curing |
|
Metal, temperature-resistant plastic and rubber |
|
| AD288 |
85.000 |
200 |
Epoxy, mineral filled, construction adhesive, very flexible |
|
Fixing of components and assembly groups |
|
| AD295 |
230.000 |
1.4 |
Epoxy, leight beige, mineral filled, high strength |
|
Metal, temperature-resistant plastic, ferrite and ceramic |
|
| AD298 |
Pasty |
1.4 |
Epoxy, mineral filled, tough-hard with high static and dynamic capacity |
|
Metal, temperature-resistant plastic, ferrite and ceramic |
|
| AD299 |
120.000 |
4 |
Epoxy, unfilled, construction adhesive, thixotropic |
|
Especially good on zinc- and nickel plated surfaces |
|
| AD480 |
Pasty |
1.4 |
Epoxy, mineral filled, tough-hard with high static and dynamic capacity |
|
Metal, temperature-resistant plastic, ferrite and ceramic |
|
| GE592 |
108.000 |
2.8 |
Anhydride-curing Epoxy, filled, low temperature curing 100°C |
|
Glob-Top chip encapsulation, chip on board |
|
| GE725 |
6.500 |
0.5 |
Anhydride-curing Epoxy, filled, black, low CTE |
|
Fill in Dam&Fill and casting of semiconductors and sensors. |
|
| GE730 |
9000 |
0.7 |
Anhydride-curing epoxi, filled, black, low CTE |
|
Glob-Top and casting of semiconductors and sensors. |
|
| GE785 |
135.000 |
0.5 |
Anhydride-curing epoxi, filled, black, low CTE |
|
Dam in Dam&Fill of semiconductors and sensors. |
|
| MG063 |
180.000 |
1.0 |
Epoxy, unfilled, tough-elastic propertiess |
|
potting / casting, coating and fixing of components |
|
| MK055 |
23.000 |
1.2 |
Epoxy, unfilled, beige, high-strength bonding |
|
No-flow-underfill for flip-chip with Pd and stud bumps |
|
| MK096 |
Pasty |
2 |
Epoxy, unfilled, red, fast initial strength |
|
Bonding and fixing of SMD components |
|
| * NU355 |
34.000 |
4.5 |
mCD, unfilled, beige, low temperature curing 80°C |
|
No-flow-underfill for flip-chip with Pd and stud bumps |
|
* mCD is a new material from DELO. It's in the epoxy familly but with some unique features. Very low curing temperature, fast and with a unique "heat pulse" function. It's enough for the whole material to "see" 80°C to start the curing process and it will continue to cure until it's fully cured. Typical aplication is to heat up the component e.g chip to 250 to 350°C and place the heated component onto the substrate with applied adhesive. Initial strength within second/seconds.
Click for more information
|
