| Electronic adhesives |
|
Product
 |
Viscosity
[mPas] |
Elongation
at tear [%] |
Caracteristics |
|
Good bonding /
materials applications |
|
Base |
|
| AD340 |
12.000 |
4 |
Dual bond Low temperature(80-150°C) and light curing. Heat pulse function |
|
For heat sensitive material and when you want to use UV-light for fixation |
|
mCD |
|
| NU355 |
34.000 |
4.5 |
Unfilled, beige, low temperature curing 80°C |
|
No-flow-underfill for flip-chip with Pd and stud bumps |
|
mCD |
|
| MK055 |
23.000 |
1.2 |
Unfilled, beige, high-strength bonding, heat curing |
|
No-flow-underfill for flip-chip with Pd and stud bumps |
|
Epoxy |
|
| MK096 |
Pasty |
2 |
Unfilled, red, fast initial strength, heat curing |
|
Bonding and fixing of SMD components |
|
Epoxy |
|
| AC265 |
26.000 |
1.7 |
ACA Anisotropic Conductive adhesive, NIAu particles |
|
Flip-chip, Smart card and Smart label aplications |
|
Epoxy |
|
| AC365 |
40.000 |
2.4 |
ACA Anisotropic Conductive adhesive, low temperature curing 80°C |
|
Flip-chip, Smart card and Smart label aplications |
|
mCD |
|
| IC343 |
55.000 |
- |
ICA Isotropic conductive adhesive, UV-fixating and low temperature curing. |
|
Electronic components to PCB or flexible circuit carrier |
|
mCD |
|
| ICA |
- |
- |
A wide range of customized ICA |
|
A wide range of applications from electronics to solar cell industri |
|
- |
|
| 4696 |
180000 thix |
17 |
Light gray translucent, high stability, low water absorption |
|
Dam in Dam&Fill applications, v-low ion content |
|
UV curing Epoxy |
|
| 4670 |
4.800 |
6 |
Light gray translucent, good flow behavior |
|
Fill in Dam&Fill applications |
|
UV curing Epoxy |
|
| GE680 |
112000 thix |
0.6 |
Milky white |
|
Chip encapsulation |
|
UV curing Epoxy |
|
| DF698 |
180000 thix |
20 |
Light gray transparent,, high stability, low water absorption |
|
Dam in Dam&Fill applications, v-low ion content |
|
UV curing Epoxy |
|
| GE592 |
108.000 |
2.8 |
Filled, low temperature curing 100°C |
|
Glob-Top chip encapsulation, chip on board |
|
Anhydride-curing Epoxy |
|
| GE725 |
6.500 |
0.5 |
Filled, black, low CTE |
|
Fill in Dam&Fill and casting of semiconductors and sensors. |
|
Anhydride-curing Epoxy |
|
| GE730 |
9.000 |
0.7 |
Filled, black, low CTE |
|
Glob-Top and casting of semiconductors and sensors. |
|
Anhydride-curing Epoxy |
|
| GE785 |
135.000 |
0.5 |
Filled, black, low CTE |
|
Dam in Dam&Fill of semiconductors and sensors. |
|
Anhydride-curing Epoxy |
|
| MG063 |
180.000 |
1 |
Unfilled, tough-elastic propertiess |
|
Potting / casting, coating and fixing of components |
|
Epoxy |
|
| AD413 |
16.000 |
250 |
Yellowish, flexible |
|
Small casting, tested for IP 67 |
|
UV-Curing Urethane acrylate |
|
| AD414 |
1.300 |
540 |
Blue fluorescent, very flexible |
|
Pin casting, Pin sealing, tested for IP 67 |
|
UV-Curing Urethane acrylate |
|
